SanDisk teams up Toshiba to launch 43nm NAND flash and X3 technology
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SanDisk and Toshiba made two announcements yesterday that promised to deliver cheaper and bigger MLC (multi-level cell) NAND flash media. First is their x3, aka three-bit-per cell technology, would allow the company to cram 20 percents more die per wafer than traditional 56nm MLC flash which uses two-bits-per-cell technology. Second is the use of 43 nanometer process technology that doubles the density per chip compared to the previous 56nm process.
SanDisk-Toshiba co-designed 43nm production process is ready to start its mass-production
[via webwire]
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Orginal post by Daniel Lim
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